EM3 offers a dedicated prototype and small volume assembly facility, which provides advanced manufacturing and inspection technologies.

Our Capabilities

• IPC-A-610 Class 3

• BGA, µBGA and Fine Pitch Loading

• BGA Rework Facility

• SMD packages down to 0402

• Reflow Facility (convection and vapour phase)

• Wave Soldering

• Through Hole Assembly

• Component Supply (Procurement/ex stock where available)

• Bare PCB Supply (Express service)

• Stencil Supply (Express service)

• In-house X-Ray Inspection Facilities

• Micro-optical Inspection (ERSA Scope)

Phone: +61 8 8245 6789    |    Email: sales@em3.entechgroup.net    |    Download Brochure

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