EM3 offers a dedicated prototype and small volume assembly facility, which provides advanced manufacturing and inspection technologies.
• IPC-A-610 Class 3
• BGA, µBGA and Fine Pitch Loading
• BGA Rework Facility
• SMD packages down to 0402
• Reflow Facility (convection and vapour phase)
• Wave Soldering
• Through Hole Assembly
• Component Supply (Procurement/ex stock where available)
• Bare PCB Supply (Express service)
• Stencil Supply (Express service)
• In-house X-Ray Inspection Facilities
• Micro-optical Inspection (ERSA Scope)
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