EM3 provides a comprehensive range of quality accredited contract manufacturing and product assembly services to the international electronics industry. Our in-house capabilities include:
• Leaded and lead free processing.
• High speed automatic SMT pick and place
• Fully automated solder paste printer with built in AOI
• Fine Pitch QFP to 0.5mm.
• BGA to 0.5mm.
• Chip components 0201.
• Through Hole Assembly Lines.
• Dual Wave, Wave Soldering machine.
• Mechanical and box build assembly.
• MDA (manufacturing defects analysis) testing.
• Full functional testing using dedicated Jigs and fixtures.
• X-Ray and Optical inspection facility for BGA placement.
• PC based test systems (Dedicated, JTAG/Boundary Scan).
• Flying Probe testing
Turnkey Product Manufacturing
• Project management and complete product life-cycle management.
• Packaging and warehousing.
• Design advice on suitability for manufacture (DFM).
• Engineering support including PCB layouts and design.
• Production tooling and test jig design and manufacture.
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